HPHE/SSPS-SH-2034Polishing Fluid

Product Parameters

itemHPHE/SSPS-SH-2034
Silica(SiO2)%38-42
proportion(20℃,g/cm³)1.265-1.3
PH(20℃)10.0-12.5
Viscosity(20℃,mm²/s)≤5
The average particle size(nm)120-140
Modified additivesHave
Stable period (months)6

Product Description

Product appearance: milky white;

Product use: suitable for polishing silicon, gallium arsenide and other semiconductor materials, with high purity and fast removal rate;

Note: 1. Packed in 25L\200L\1000L polyethylene plastic barrel, transported and stored in an environment of 0~40℃;

        2. Avoid contact with eyes and skin during use. If you accidentally touch it, rinse it off with running water.


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